PCB prototype

We understand how important it is to have the boards you ordered reach assembly ASAP. That's why we've made every effort to strengthen our core competencies, honing our manufacturing capabilities to ensure that we meet your order schedule in the shortest possible time.

Providing fastest board  turnaround solution
Layer Count	Fastest turnaround time	Order size
2-6 Layer	1-2 working days	up to 2000 sq-in
8-12 Layer	3 working days	up to 1500 sq-in
14-18 Layer	4 working days	up to 1000 sq-in
20 Layer Above	5 working days	up to 500 sq-in

 

We specialize in Quick turn PCB services with an industry leading turnaround time as fast as 72 hours.Not only do we know the importance of ensuring quick turnaround for the success of your project, but we also know that the resulting quality is equally as important. With our integrated in-house facility, 687-strong workforce, 87-plus dedicated engineer, 42 different PCB processing stations, and 24/5 production schedule, we can fulfill all PCB prototype projects on tight deadlines faster than the average lead times most PCB service companies can achieve - and with quality, of course. This means the shortest turnaround times and the highest quality for any HDI PCB project as well.

Our current production capacity, which is 80,000 sq-ft of high quality and reliable PCBs, can meet customers' requirements for single to 50-layer boards in the shortest possible time. At our facility, the more layers required, the lesser time we need compared to the average.

When your company needs fast and rapid PCB prototyping, know that you can count on Hemeixin to deliver high quality printed circuit boards on time at competitive prices.

We have an industry leading on-time percentage that customers have come to love. We understand the importance of delivering on our promises, so we have a rock solid customer satisfaction guarantee.

Quick turn PCB

Today’s OEMs are tasked with supplying higher performance products that require increasingly complex printed circuit boards (PCBs) while reducing cycle times and bringing products to market faster. This drives the need for quick turn PCB fabrication regardless of the complexity of the board, backed by advanced manufacturing processes and high mix production capabilities.

Hemeixin Electronics Co.,Ltd, through its Quick Turn Around (QTA) capability, provides a wide range of prototype/new product introduction PCBs in the early design phase so that customers can stabilize new designs and then get them to market quickly.
“Due to an increase in demand in the defense/aerospace, IT/supercomputer, medical and ATE markets, we have created a separate and dedicated QTA fabrication line with its own set of equipment, processes and operations personnel,” said PPC Manager, Director of QTA Operations at HemeixinPCB. “We have invested in QTA capability in order to provide 1 to 10 day turn around times, including those PCBs requiring complex technologies, high layer counts, high density interconnect and advanced manufacturing processes. Early successes include wins with new customers as well as new opportunities with existing customers.”
The attached photo shows an example of a fabricated QTA PCB. This is a 36 layer board with impedance control, gold surface finish, a 30:1 aspect ratio, depth controlled back drilling and pattern plating and was supplied in prototype quantities.
Once the prototype board is evaluated and approved by the customer, HemeixinPCB can seamlessly switch to production quantities, since its QTA line is a mirror image of the tools and processes employed in the standard fabrication line, which is widely recognized for producing outstanding PCB quality. In addition, the staff at HemeixinPCB can offer expertise in design for manufacturability and process optimization for improving yields and product reliability.

News Flexible circuit Bending

The reliability of flex circuits depends on careful design. Factors that can affect that reliability include:
•symmetry of design
•bend angle
•circuit thickness
•static vs. dynamic application
•choice of materials
•placement of features
•forming technique
•conductor routing
•discontinuities in the bend area

Careful planning and attention to these factors should produce a circuit that suits its application and delivers allthe benefits of flex circuitry at the lowest cost. When in doubt about how to best achieve specific goals in a flex circuit application, an experienced manufacturer can be invaluable in evaluating and balancing requirements,answering questions, and providing solutions.

A variety of factors can impact a circuit’s performance when flexed. These include:

•The closer the neutral bend axis falls to the center of the circuit’s material stack, the more evenly forces will be distributed among the other layers of the circuit when it is flexed

•Bend angle – the less a circuit is flexed, the smaller the risk of damage

•Thickness of the circuit – less thickness reduces the risk of damage when flexed

•Bend radius – a larger radius helps reduce the risk of damage

•Frequency of flexing – construction that might not be acceptable for a dynamic application, one in which the circuit will be flexed regularly, may be acceptable in a circuit designed to bend only once for installation

•Materials – proper selection of materials for their ability to accommodate flex and the way they transmit those forces to other layers in the bend area will improve performance

•Construction – designers should avoid placement in or near the bend area of features that are particularly vulnerable to forces generated in the bend area, or that can weaken surrounding circuit structure when flexed

Flex PCBs have been a key enabler of modern high density electronics, but achieving this density requires thinner layers and finer lines. Conventional three-layer flex circuits comprised of copper, polyimide, and bonding adhesives are giving way to thinner, smoother two-layer flex circuits that forego the adhesive layer – the copper is instead deposited directly on the polyimide. These two-layer circuits may be as thin as 30 µm, with line spacing as fine as 15 µm (0.6 mils). It’s imperative, therefore, that the processed panels are handled extremely carefully to avoid causing wrinkles, tension, or scratches.

Special design for manufacturing (DFM) software tools for flex circuits help neutralize production problems during the design stage. These advanced tools are used to fully automate manual editing sessions, reducing errors and critical cycle time. Among today’s available flex DFMs are automatic joint curving and surface smoothing, and automated coverlay and solder mask optimization that make design faster, higher quality, and more accurate.

its eliminate these joints, making them much more reliable and able to deliver overall higher product quality and longevity. So while rigid-flex PCB technology is certainly not new, various considerations now make it much more viable – not the least of which is cost.

Thermally Conductive PCB

Hemeixinpcb, a thermal management technology company, announced its new MCPCB product, Copper Via embedded Aluminum Core PCB. This highly thermal conductive MCPCB is comprised of a regular aluminum core PCB and a specially embedded Copper Via that effectively draws the heat from the elements bonded on the top surface and distributes it to the aluminum core of the MCPCB. This innovation enables circuit engineers to have much less thermal restriction in circuit design and it offers more flexibility in components selection This unique and cost effective process developed by Cofan USA to embed Copper Via onto the Aluminum Core is completely contamination-free, and it makes it possible to integrate into conventional Aluminum Core PCB manufacturing processes. As a result, the MCPCB’s thermal conductivity is further enhanced through the Copper Vias, with no increase in cost. The cost is the same as an Aluminum Core PCBs which is relatively much lower than that of Copper Vias on Copper Core PCB. This Copper Via embedded Aluminum Core PCB is currently available for order, and ready for market consumption as with the conventional MCPCB with Copper Vias on Copper Core.

    When the copper metal pricing went higher and higher, use small pieces of metal to solve the thermal dissipation problem become important. Locally bond the metal coin by bonding film or sweat bonding is one solution. Plug the metal inside the PCB is another. One advantage for this process is the metal can be fit into the multiplayer construction during lamination process. The coin grounding can be done by drill through hole or use sweat bonding.


      For the double side PCB, plug the metal in PCB is also possible. It can be done by a process similar to hole plugging which we fill the epoxy resin in the slit between PCB and metal coin. However, the metal thickness need to by the closeto the PCB. Usually designer will ask the metal coin should be very flat at least on one side. The quality control need to be careful.

    Similar insertion design can be done by sweat bonding process. It is still in concept stage. But I think it can be done, too. It's a post bond process. One advantage is that only PCB pass the QA process will go to bonding procedure. Please see my article "Sweat solder bonding technology for metal PCB".
If the PCB is mutilayer,  and it needs to ground one of the layer to the metal coin, use electrically conductive paste is one solution. The slot needs to be edge plated first. The the conductive paste fill in before outter layer processing.  The conductive paste area on top layer can covered with solder mask to avoid any kind of circuit short.
    One advantage of coin insertion PCB is the light weight and easier assemble. For a metal bonded PCB, before the PCB assembly, a long time preheat is necessary. Cooling time is also longer for its high thermal capacity. For copper insertion PCB, if the coin size is small compare to whole PCB, the PCB assembly is almost not be affected. Compare to locally bonded coin, the flat structure can eliminate the using of special fixture.
8. High power LED substrate
    For a packed LED component, aluminum based IMS design is widely used in the industry (see Fig 5). The heat transfer from component go through a high thermal conductivity (no less than 1 W/m-k) material to aluminum plate. The thickness of the dilectric material needs to be select carefully. The thiner dielectric which have lower thermal resistance may cause dielectric breakdown problem.

    The LED chip can put directly on a LED substrate with cup design and copper backing to reduce cost and resolve heat problem. The quality of LED chip maybe a problem needs to be concerned. The cup usually designed with an optimum angle and plated with silver to get better reflectivity. The bonindg pad need to be plated with bondable metal like thick gold, silver or Ni/Pd/Au.

Boardtek also owned a patent which use a plastc or metal pre-formed cup to replace the cup that need to be machined in PCB. It can save a lot of cost and have better light performance.

Heavy copper circuits

Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: heavy copper and extreme copper printed circuit boards.

What defines a heavy copper circuit? Most commercially available PCBs are manufactured for low-voltage/low-power applications, with copper traces/planes made up of copper weights ranging from 1/2oz/ft 2 to 3oz/ft 2. A heavy copper circuit is manufactured with copper weights anywhere from 4oz/ft 2 to 20oz/ft 2. Copper weights higher than 20oz/ft 2, and up to 200oz/ft 2 are also possible and are referred to as extreme copper. For our discussion here, we will focus primarily on heavy copper. The increased copper weight, combined with a suitable substrate and thicker plating in the through holes, can transform the once unreliable, weak circuit board into a durable and reliable wiring platform.
It's probably no one really need fine line with heavy copper like 5 oz thick. If it is real, can we make it? Well, I did not specify the trace space. If no space issue and the definition of the trace width is to measuer its bottom side, then what will be the width of this 5 mil wide trace on its top side? For a etching factor of 2, the width will be zero. It means the 5 mil wide pattern will not able to created by standard etching process. So, how do I make this happen?
 I invented a process to make thick copper by electroplating process. The purpose of the process is making heavy copper and thin copper on the same layer. Use the same way, we can make 5 oz copper trace with width of 5 mil. In fact, the more stringent criteria like 8 oz thick with 5 mil wide will probably OK. Since 8 oz copper is more than 11 mil thick, the trace aspect raio is bigger than 2!
So, how do I make it? We can start with 6 mil thick single side laminate with 1 oz copper clad. Cover the claded copper by photoresist or tape. Then, use laser to cut the circuits pattern from its no clading side with width of 5 mil (you can image that 4 mil or thinner is also possible). The laser cutting needs to cut into the copper foil on the opposite side so that the copper can be exposed. The claded copper is usually not damaged by laser if it is under control. The space between 2 traces can be 5 mil or higher, depend on how serious you have to concern on CAF issue. A desmear process is needed if you use CO2 laser. It can remove any resin residue on the bottom of the copper. Then, we can put it into the plating tank for copper plating. This is just like a pattern plating process used in PCB with very thick plating resisit. The plated copper will fill the laser cut groove, or circuit pattern, after enough plating time. In this case, the plated copper thickness is roughly 6 mil. We can use this plated laminate, after remove the photoresist, as an inner layer or outer layer core. After lamination with other circuits, the plated core can be etched from top side with copper foil clading. Together with the plated copper, the 1 oz copper foil plus 6 mil can have the total copper thickness over 5 oz. 
Like the previuos article, the etching can make the board having thinner copper when this etching process does not on the plating area. So, the thick and thin copper can be done on the same layer. Since most of the heavy copper is buried into laminate, the this and thick copper is on the same level without worry its height difference. And, since the heavy copper buried into core, we don't need to worry the peel strength of this thick trace even it has finer line.

PCB Assembly and PCB Fabrication

If you prototype printed circuit boards in the China., how can you ensure that laminates and prepregs you used will match those used in offshore volume production?

As an industry, those of us involved in designing and manufacturing electronic products can all agree that we now live and operate in a global supply chain environment. Since a lot of what is incorporated into current and next generation products is reflected in the software, this isn't much of a concern. Take your favorite products, download the latest software update and newly developed apps and you're ready to go.
When it comes to developing the pieces of hardware, the process is not so simple. And, when it comes to printed circuit board (PCB) development efforts, the process becomes even more challenging. That's because PCBs are the launching points for hardware product development and the laminate and prepreg materials used in designing and manufacturing PCBs are the nuclei for those boards. (Prepreg is fiberglass cloth that has been saturated with resin that is not fully cured. As a PCB is placed under the heat and pressure of lamination this resin melts and flows into the voids in the adjacent copper layers filling them.)
Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey to their OEM customers their highest confidences that their products are of the foremost quality and have been verified to operate according to their specifications.
An automatic test equipment printed circuit board, or ATE PCB -- serving as an interface to a large test system -- is at the heart of all major test activities to verify a specific chip's functionality.
This assures chipmakers their semiconductor products are good-to-go to an ever- burgeoning chip market led by newcomers, such as Internet of Things (IoT), wearables, handheld devices, and other similar products.
ATE PCBs are designed and assembled to test an array of different semiconductor chips, including microprocessors (µPs), memory, system-on-a-chip (SoC), field-programmable gate arrays (FPGAs), and others. However, an ATE PCB is designed and assembled specifically to test one particular kind of chip set. Some of today's highly advanced chips bring tens of millions of dollars into a chipmaker's coffers.
In order to achieve that highly-prized chip-testing quality for chipmakers, a group of experienced program and project managers and highly-trained and savvy engineering personnel in ATE PCB assembly are of paramount importance. The requirements for disciplined administration management and assembly line technical knowhow are above and beyond that required for conventional PCB assembly. Considerable monetary loss and lost time-to-market are incurred if there's a misstep along the way toward successful assembly completion of an ATE PCB.

Quick turn prototype assembly

HemeixinPCB provide quick-turn prototype, low-volume and production PCB assembly with surface-mount (SMT), through-hole (THT) and mix components. We offer turn-key (just send us the Gerber and BOM files), consignment (you supply all parts) and various components purchase options to help you reduce cost and wait time.

• Less than 0.05% return rate on all PCBs manufactured
• Our 100% guarantee on manufacturing defects
• Optional Engineering Review to analyze and report on any manufacturability issues with your design as submitted
• Flying-Probe Electrical Test: comparing your PCBs electrically to your submitted Gerber files
• Self-service DFM checking with our online DFMplus service
• PCB circuit board assembly in as little as 24 hours
• As few as one board
• Full RoHS compliance available
• Easy and complete online quote and order process
• Kitted or turn-key processing available
• Machine placement of parts from 0201 passives to high-pin BGAs
• IPC-A-610 Class III and TS16949 available

Our quick-turn prototyping service can assemble your boards within 24 hours. We can handle small quantity as well as volume productions. All our services are at a very competitive price and with 100% satisfaction guarantee.

PCB prototype

We understand how important it is to have the boards you ordered reach assembly ASAP. That's why we've made every effort to strengthen our core competencies, honing our manufacturing capabilities to ensure that we meet your order schedule in the shortest possible time.

Providing fastest board  turnaround solution
Layer Count	Fastest turnaround time	Order size
2-6 Layer	1-2 working days	up to 2000 sq-in
8-12 Layer	3 working days	up to 1500 sq-in
14-18 Layer	4 working days	up to 1000 sq-in
20 Layer Above	5 working days	up to 500 sq-in

 

We specialize in Quick turn PCB services with an industry leading turnaround time as fast as 72 hours.Not only do we know the importance of ensuring quick turnaround for the success of your project, but we also know that the resulting quality is equally as important. With our integrated in-house facility, 687-strong workforce, 87-plus dedicated engineer, 42 different PCB processing stations, and 24/5 production schedule, we can fulfill all PCB prototype projects on tight deadlines faster than the average lead times most PCB service companies can achieve - and with quality, of course. This means the shortest turnaround times and the highest quality for any HDI PCB project as well.

Our current production capacity, which is 80,000 sq-ft of high quality and reliable PCBs, can meet customers' requirements for single to 50-layer boards in the shortest possible time. At our facility, the more layers required, the lesser time we need compared to the average.

When your company needs fast and rapid PCB prototyping, know that you can count on Hemeixin to deliver high quality printed circuit boards on time at competitive prices.

We have an industry leading on-time percentage that customers have come to love. We understand the importance of delivering on our promises, so we have a rock solid customer satisfaction guarantee.

Quick turn PCB

Today’s OEMs are tasked with supplying higher performance products that require increasingly complex printed circuit boards (PCBs) while reducing cycle times and bringing products to market faster. This drives the need for quick turn PCB fabrication regardless of the complexity of the board, backed by advanced manufacturing processes and high mix production capabilities.

Hemeixin Electronics Co.,Ltd, through its Quick Turn Around (QTA) capability, provides a wide range of prototype/new product introduction PCBs in the early design phase so that customers can stabilize new designs and then get them to market quickly.
“Due to an increase in demand in the defense/aerospace, IT/supercomputer, medical and ATE markets, we have created a separate and dedicated QTA fabrication line with its own set of equipment, processes and operations personnel,” said PPC Manager, Director of QTA Operations at HemeixinPCB. “We have invested in QTA capability in order to provide 1 to 10 day turn around times, including those PCBs requiring complex technologies, high layer counts, high density interconnect and advanced manufacturing processes. Early successes include wins with new customers as well as new opportunities with existing customers.”
The attached photo shows an example of a fabricated QTA PCB. This is a 36 layer board with impedance control, gold surface finish, a 30:1 aspect ratio, depth controlled back drilling and pattern plating and was supplied in prototype quantities.
Once the prototype board is evaluated and approved by the customer, HemeixinPCB can seamlessly switch to production quantities, since its QTA line is a mirror image of the tools and processes employed in the standard fabrication line, which is widely recognized for producing outstanding PCB quality. In addition, the staff at HemeixinPCB can offer expertise in design for manufacturability and process optimization for improving yields and product reliability.

rigid flex circuits

WHAT IS RIGID-FLEX?

As the name suggests, a flexible printed circuit is a pattern of conductors printed onto a flexible insulating film. Rigid-flex is the name given to a printed circuit that is a combination of both flexible circuit(s) and rigid circuit(s), as shown in the image above. This combination is ideal for exploiting the benefits of both flexible and rigid circuits - the rigid circuits can carry all or the bulk of the components, with the flexible sections acting as interconnections between the rigid sections.

Flexible circuit technology was initially developed for the space program to save space and weight. They are popular today as they not only save space and weight - making them ideal for portable devices such as mobile phones and tablets - they can also: reduce packaging complexity by substantially reducing the need for interconnect wiring; improve product reliability due to reduced interconnection hardware and improved assembly yields; and reduce cost, when considered as part of the overall product manufacture and assembly costs.

Flexible circuits are normally divided into 2 usage classes: static flexible circuits, and dynamic flexible circuits. Static flexible circuits (also referred to as use A) are those that undergo minimal flexing, typically during assembly and service. Dynamic flexible circuits (also referred to as use B) are those that are designed for frequent flexing; such as a disk drive head, a printer head, or as part of the hinge in a laptop screen. This distinction is important as it affects both the material selection and the construction methodology. There is a number of layer stack-up configurations that can be fabricated as rigid-flex, each with their own electrical, physical and cost advantages.

A rigid-flex design does not have a consistent set of layers across the entire circuit design, the rigid section of the board will have a different set of layers from the flexible section. And if the rigid-flex design has a number of rigid sections joined by a number of flex sections, then there may be a different set of layers used in each of these sections. A PCB editor with a single layer stack cannot support this design requirement. To support this, In rigid-flex packaging, a flexible circuit substrate provides a backbone of wiring with rigid multiplayer circuit sections built-up as modules where needed., as shown below.

The Layer Stack Manager supports the definition of any number of layer stacks.

When to use rigid flex circuit board?

It’s getting harder to fit everything in the box; it’s also getting more costly. One solution promising to help designers meet the size constraint head on is rigid-flex PCB technology, but most design teams try to avoid using rigid-flex PCBs when product cost is an issue. But is it really as expensive as we think?

To begin with, consider the cost of the traditional rigid-cable-rigid PCB assembly to one based on rigid-flex technology. The former construction works well for short-run designs; however, it requires connectors on each board and the interconect, all of which drive up BoM cost. Additionally, the rigid-cable-rigid design is prone to ‘cold joints’, and reduced service life. In contrast, rigid-flex circuits eliminate these joints, making them much more reliable and able to deliver overall higher product quality and longevity. So while rigid-flex PCB technology is certainly not new, various considerations now make it much more viable – not the least of which is cost.

Flexible circuit Bending

The reliability of flex circuits depends on careful design. Factors that can affect that reliability include:
•symmetry of design
•bend angle
•circuit thickness
•static vs. dynamic application
•choice of materials
•placement of features
•forming technique
•conductor routing
•discontinuities in the bend area

Careful planning and attention to these factors should produce a circuit that suits its application and delivers allthe benefits of flex circuitry at the lowest cost. When in doubt about how to best achieve specific goals in a flex circuit application, an experienced manufacturer can be invaluable in evaluating and balancing requirements,answering questions, and providing solutions.

A variety of factors can impact a circuit’s performance when flexed. These include:

•The closer the neutral bend axis falls to the center of the circuit’s material stack, the more evenly forces will be distributed among the other layers of the circuit when it is flexed

•Bend angle – the less a circuit is flexed, the smaller the risk of damage

•Thickness of the circuit – less thickness reduces the risk of damage when flexed

•Bend radius – a larger radius helps reduce the risk of damage

•Frequency of flexing – construction that might not be acceptable for a dynamic application, one in which the circuit will be flexed regularly, may be acceptable in a circuit designed to bend only once for installation

•Materials – proper selection of materials for their ability to accommodate flex and the way they transmit those forces to other layers in the bend area will improve performance

•Construction – designers should avoid placement in or near the bend area of features that are particularly vulnerable to forces generated in the bend area, or that can weaken surrounding circuit structure when flexed

Flex PCBs have been a key enabler of modern high density electronics, but achieving this density requires thinner layers and finer lines. Conventional three-layer flex circuits comprised of copper, polyimide, and bonding adhesives are giving way to thinner, smoother two-layer flex circuits that forego the adhesive layer – the copper is instead deposited directly on the polyimide. These two-layer circuits may be as thin as 30 µm, with line spacing as fine as 15 µm (0.6 mils). It’s imperative, therefore, that the processed panels are handled extremely carefully to avoid causing wrinkles, tension, or scratches.

Special design for manufacturing (DFM) software tools for flex circuits help neutralize production problems during the design stage. These advanced tools are used to fully automate manual editing sessions, reducing errors and critical cycle time. Among today’s available flex DFMs are automatic joint curving and surface smoothing, and automated coverlay and solder mask optimization that make design faster, higher quality, and more accurate.

its eliminate these joints, making them much more reliable and able to deliver overall higher product quality and longevity. So while rigid-flex PCB technology is certainly not new, various considerations now make it much more viable – not the least of which is cost.

Thermally Conductive PCB

Hemeixinpcb, a thermal management technology company, announced its new MCPCB product, Copper Via embedded Aluminum Core PCB. This highly thermal conductive MCPCB is comprised of a regular aluminum core PCB and a specially embedded Copper Via that effectively draws the heat from the elements bonded on the top surface and distributes it to the aluminum core of the MCPCB. This innovation enables circuit engineers to have much less thermal restriction in circuit design and it offers more flexibility in components selection This unique and cost effective process developed by Cofan USA to embed Copper Via onto the Aluminum Core is completely contamination-free, and it makes it possible to integrate into conventional Aluminum Core PCB manufacturing processes. As a result, the MCPCB’s thermal conductivity is further enhanced through the Copper Vias, with no increase in cost. The cost is the same as an Aluminum Core PCBs which is relatively much lower than that of Copper Vias on Copper Core PCB. This Copper Via embedded Aluminum Core PCB is currently available for order, and ready for market consumption as with the conventional MCPCB with Copper Vias on Copper Core.

    When the copper metal pricing went higher and higher, use small pieces of metal to solve the thermal dissipation problem become important. Locally bond the metal coin by bonding film or sweat bonding is one solution. Plug the metal inside the PCB is another. One advantage for this process is the metal can be fit into the multiplayer construction during lamination process. The coin grounding can be done by drill through hole or use sweat bonding.


      For the double side PCB, plug the metal in PCB is also possible. It can be done by a process similar to hole plugging which we fill the epoxy resin in the slit between PCB and metal coin. However, the metal thickness need to by the closeto the PCB. Usually designer will ask the metal coin should be very flat at least on one side. The quality control need to be careful.

    Similar insertion design can be done by sweat bonding process. It is still in concept stage. But I think it can be done, too. It's a post bond process. One advantage is that only PCB pass the QA process will go to bonding procedure. Please see my article "Sweat solder bonding technology for metal PCB".
If the PCB is mutilayer,  and it needs to ground one of the layer to the metal coin, use electrically conductive paste is one solution. The slot needs to be edge plated first. The the conductive paste fill in before outter layer processing.  The conductive paste area on top layer can covered with solder mask to avoid any kind of circuit short.
    One advantage of coin insertion PCB is the light weight and easier assemble. For a metal bonded PCB, before the PCB assembly, a long time preheat is necessary. Cooling time is also longer for its high thermal capacity. For copper insertion PCB, if the coin size is small compare to whole PCB, the PCB assembly is almost not be affected. Compare to locally bonded coin, the flat structure can eliminate the using of special fixture.
8. High power LED substrate
    For a packed LED component, aluminum based IMS design is widely used in the industry (see Fig 5). The heat transfer from component go through a high thermal conductivity (no less than 1 W/m-k) material to aluminum plate. The thickness of the dilectric material needs to be select carefully. The thiner dielectric which have lower thermal resistance may cause dielectric breakdown problem.

    The LED chip can put directly on a LED substrate with cup design and copper backing to reduce cost and resolve heat problem. The quality of LED chip maybe a problem needs to be concerned. The cup usually designed with an optimum angle and plated with silver to get better reflectivity. The bonindg pad need to be plated with bondable metal like thick gold, silver or Ni/Pd/Au.

Boardtek also owned a patent which use a plastc or metal pre-formed cup to replace the cup that need to be machined in PCB. It can save a lot of cost and have better light performance.

Thermally Conductive PCB

Hemeixinpcb, a thermal management technology company, announced its new MCPCB product, Copper Via embedded Aluminum Core PCB. This highly thermal conductive MCPCB is comprised of a regular aluminum core PCB and a specially embedded Copper Via that effectively draws the heat from the elements bonded on the top surface and distributes it to the aluminum core of the MCPCB. This innovation enables circuit engineers to have much less thermal restriction in circuit design and it offers more flexibility in components selection This unique and cost effective process developed by Cofan USA to embed Copper Via onto the Aluminum Core is completely contamination-free, and it makes it possible to integrate into conventional Aluminum Core PCB manufacturing processes. As a result, the MCPCB’s thermal conductivity is further enhanced through the Copper Vias, with no increase in cost. The cost is the same as an Aluminum Core PCBs which is relatively much lower than that of Copper Vias on Copper Core PCB. This Copper Via embedded Aluminum Core PCB is currently available for order, and ready for market consumption as with the conventional MCPCB with Copper Vias on Copper Core.

    When the copper metal pricing went higher and higher, use small pieces of metal to solve the thermal dissipation problem become important. Locally bond the metal coin by bonding film or sweat bonding is one solution. Plug the metal inside the PCB is another. One advantage for this process is the metal can be fit into the multiplayer construction during lamination process. The coin grounding can be done by drill through hole or use sweat bonding.


      For the double side PCB, plug the metal in PCB is also possible. It can be done by a process similar to hole plugging which we fill the epoxy resin in the slit between PCB and metal coin. However, the metal thickness need to by the closeto the PCB. Usually designer will ask the metal coin should be very flat at least on one side. The quality control need to be careful.

    Similar insertion design can be done by sweat bonding process. It is still in concept stage. But I think it can be done, too. It's a post bond process. One advantage is that only PCB pass the QA process will go to bonding procedure. Please see my article "Sweat solder bonding technology for metal PCB".
If the PCB is mutilayer,  and it needs to ground one of the layer to the metal coin, use electrically conductive paste is one solution. The slot needs to be edge plated first. The the conductive paste fill in before outter layer processing.  The conductive paste area on top layer can covered with solder mask to avoid any kind of circuit short.
    One advantage of coin insertion PCB is the light weight and easier assemble. For a metal bonded PCB, before the PCB assembly, a long time preheat is necessary. Cooling time is also longer for its high thermal capacity. For copper insertion PCB, if the coin size is small compare to whole PCB, the PCB assembly is almost not be affected. Compare to locally bonded coin, the flat structure can eliminate the using of special fixture.
8. High power LED substrate
    For a packed LED component, aluminum based IMS design is widely used in the industry (see Fig 5). The heat transfer from component go through a high thermal conductivity (no less than 1 W/m-k) material to aluminum plate. The thickness of the dilectric material needs to be select carefully. The thiner dielectric which have lower thermal resistance may cause dielectric breakdown problem.

    The LED chip can put directly on a LED substrate with cup design and copper backing to reduce cost and resolve heat problem. The quality of LED chip maybe a problem needs to be concerned. The cup usually designed with an optimum angle and plated with silver to get better reflectivity. The bonindg pad need to be plated with bondable metal like thick gold, silver or Ni/Pd/Au.

Boardtek also owned a patent which use a plastc or metal pre-formed cup to replace the cup that need to be machined in PCB. It can save a lot of cost and have better light performance.

Heavy copper circuits

Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: heavy copper and extreme copper printed circuit boards.

What defines a heavy copper circuit? Most commercially available PCBs are manufactured for low-voltage/low-power applications, with copper traces/planes made up of copper weights ranging from 1/2oz/ft 2 to 3oz/ft 2. A heavy copper circuit is manufactured with copper weights anywhere from 4oz/ft 2 to 20oz/ft 2. Copper weights higher than 20oz/ft 2, and up to 200oz/ft 2 are also possible and are referred to as extreme copper. For our discussion here, we will focus primarily on heavy copper. The increased copper weight, combined with a suitable substrate and thicker plating in the through holes, can transform the once unreliable, weak circuit board into a durable and reliable wiring platform.
It's probably no one really need fine line with heavy copper like 5 oz thick. If it is real, can we make it? Well, I did not specify the trace space. If no space issue and the definition of the trace width is to measuer its bottom side, then what will be the width of this 5 mil wide trace on its top side? For a etching factor of 2, the width will be zero. It means the 5 mil wide pattern will not able to created by standard etching process. So, how do I make this happen?
 I invented a process to make thick copper by electroplating process. The purpose of the process is making heavy copper and thin copper on the same layer. Use the same way, we can make 5 oz copper trace with width of 5 mil. In fact, the more stringent criteria like 8 oz thick with 5 mil wide will probably OK. Since 8 oz copper is more than 11 mil thick, the trace aspect raio is bigger than 2!
So, how do I make it? We can start with 6 mil thick single side laminate with 1 oz copper clad. Cover the claded copper by photoresist or tape. Then, use laser to cut the circuits pattern from its no clading side with width of 5 mil (you can image that 4 mil or thinner is also possible). The laser cutting needs to cut into the copper foil on the opposite side so that the copper can be exposed. The claded copper is usually not damaged by laser if it is under control. The space between 2 traces can be 5 mil or higher, depend on how serious you have to concern on CAF issue. A desmear process is needed if you use CO2 laser. It can remove any resin residue on the bottom of the copper. Then, we can put it into the plating tank for copper plating. This is just like a pattern plating process used in PCB with very thick plating resisit. The plated copper will fill the laser cut groove, or circuit pattern, after enough plating time. In this case, the plated copper thickness is roughly 6 mil. We can use this plated laminate, after remove the photoresist, as an inner layer or outer layer core. After lamination with other circuits, the plated core can be etched from top side with copper foil clading. Together with the plated copper, the 1 oz copper foil plus 6 mil can have the total copper thickness over 5 oz. 
Like the previuos article, the etching can make the board having thinner copper when this etching process does not on the plating area. So, the thick and thin copper can be done on the same layer. Since most of the heavy copper is buried into laminate, the this and thick copper is on the same level without worry its height difference. And, since the heavy copper buried into core, we don't need to worry the peel strength of this thick trace even it has finer line.

PCB Assembly and PCB Fabrication

If you prototype printed circuit boards in the China., how can you ensure that laminates and prepregs you used will match those used in offshore volume production?

As an industry, those of us involved in designing and manufacturing electronic products can all agree that we now live and operate in a global supply chain environment. Since a lot of what is incorporated into current and next generation products is reflected in the software, this isn't much of a concern. Take your favorite products, download the latest software update and newly developed apps and you're ready to go.
When it comes to developing the pieces of hardware, the process is not so simple. And, when it comes to printed circuit board (PCB) development efforts, the process becomes even more challenging. That's because PCBs are the launching points for hardware product development and the laminate and prepreg materials used in designing and manufacturing PCBs are the nuclei for those boards. (Prepreg is fiberglass cloth that has been saturated with resin that is not fully cured. As a PCB is placed under the heat and pressure of lamination this resin melts and flows into the voids in the adjacent copper layers filling them.)
Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey to their OEM customers their highest confidences that their products are of the foremost quality and have been verified to operate according to their specifications.
An automatic test equipment printed circuit board, or ATE PCB -- serving as an interface to a large test system -- is at the heart of all major test activities to verify a specific chip's functionality.
This assures chipmakers their semiconductor products are good-to-go to an ever- burgeoning chip market led by newcomers, such as Internet of Things (IoT), wearables, handheld devices, and other similar products.
ATE PCBs are designed and assembled to test an array of different semiconductor chips, including microprocessors (µPs), memory, system-on-a-chip (SoC), field-programmable gate arrays (FPGAs), and others. However, an ATE PCB is designed and assembled specifically to test one particular kind of chip set. Some of today's highly advanced chips bring tens of millions of dollars into a chipmaker's coffers.
In order to achieve that highly-prized chip-testing quality for chipmakers, a group of experienced program and project managers and highly-trained and savvy engineering personnel in ATE PCB assembly are of paramount importance. The requirements for disciplined administration management and assembly line technical knowhow are above and beyond that required for conventional PCB assembly. Considerable monetary loss and lost time-to-market are incurred if there's a misstep along the way toward successful assembly completion of an ATE PCB.

Rigid-flex PCB Design

Hemeixinpcb can assemble hardware and electronic components onto your flex and rigid-flex PCB circuits.  The purpose of this design guide is to enable you to design a highly reliable, flexible printed circuit optimized for manufacturability.

While using this guide, keep in mind that the design information provided is only a suggestion. HemeixinPCB takes pride in manufacturing flex circuits that are considered difficult to build. In most cases, we do build above and beyond the “standard” circuit specifications, provided that the circuit design and type allow for it.

Rigid-flex: A blend of rigid and flex emphasizing the best of both constructions, adding synergistic capabilities neither possess alone. In its most typical configuration, the rigid-flex PCB is a series of rigid PCBs joined by integrated flex circuits (with emphasis on the high percentage of rigid area content). Circuits designed primarily as flex circuits have great opportunities to increase your design capabilities when integrated rigid areas are added.

Rigid areas provide excellent hard mount points for components, connectors and chassis while flex areas offer dynamic flexing, flex to fit, and component mounting poised to take advantage of these low mass and vibration resistant zones. This blending leads to creative solutions for your most demanding applications.

Double side component mounting: Rigid-flex PCB circuits are the ideal solution for flex circuits where surface mount components must be mounted on both sides of the board.

Total cost of ownership: The maximum benefit of rigid-flex PCB is realized when the complete installation is reviewed for total cost of ownership. Using rigid-flex PCB eliminates connections in the flex-to-rigid transitions which can improve reliability and improve impedance control.

Most capable/Maximum vibration resistance: Lets you integrate the best capabilities of resistant rigid areas and resilient flex areas.

High mass component mounting: When mounting a high mass component, a rigid board is the right solution. A rigid-flex PCB board gives you a smooth transition between rigid and flex areas while preserving the benefits of each.

Rigid-flex PCB description:

IPC-6013, MIL-P-50884 - Type 4

Two or more conductive layers with either flexible or rigid insulation material as insulators between each one; outer layers may have covers or exposed pads.

A Rigid-flex has conductors on the rigid layers, which differentiates it from multilayer circuits with stiffeners. Plated through-holes extend through both rigid and flexible layers (with the exception of blind and buried vias). Rigid-flex costs more than a standard circuit with stiffeners.

Access holes or exposed pads without covers may be on either or both sides. Vias or interconnects can be fully covered for maximum insulation.

Stiffeners, pins, connectors, components, heat sinks, and mounting brackets are optional.

We also manufacture “flush” rigid-flex, where the top surface of contact areas is level with adjacent adhesive /insulation.

Hemeixinpcb is capable of sequentially laminating, drilling, and plating circuits, which allows for more flexibility in designing the circuit.

Materials:

Polyimide film: ½ mil (12μm), 1 mil (25μm)*, 2 mil (50μm)*, 3 mil (75μm), 5 mil (125μm); Liquid Photo imageable Coverlay (LPI); Epoxy glass or polyimide glass (rigid-flex PCB).

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another.

The proper application of Rigid-Flex PCB circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components.


Additional advantages of Rigid-Flex PCB circuit boards are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics.

Heavy copper circuits

Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: heavy copper and extreme copper printed circuit boards.

What defines a heavy copper circuit? Most commercially available PCBs are manufactured for low-voltage/low-power applications, with copper traces/planes made up of copper weights ranging from 1/2oz/ft 2 to 3oz/ft 2. A heavy copper circuit is manufactured with copper weights anywhere from 4oz/ft 2 to 20oz/ft 2. Copper weights higher than 20oz/ft 2, and up to 200oz/ft 2 are also possible and are referred to as extreme copper. For our discussion here, we will focus primarily on heavy copper. The increased copper weight, combined with a suitable substrate and thicker plating in the through holes, can transform the once unreliable, weak circuit board into a durable and reliable wiring platform.
It's probably no one really need fine line with heavy copper like 5 oz thick. If it is real, can we make it? Well, I did not specify the trace space. If no space issue and the definition of the trace width is to measuer its bottom side, then what will be the width of this 5 mil wide trace on its top side? For a etching factor of 2, the width will be zero. It means the 5 mil wide pattern will not able to created by standard etching process. So, how do I make this happen?
 I invented a process to make thick copper by electroplating process. The purpose of the process is making heavy copper and thin copper on the same layer. Use the same way, we can make 5 oz copper trace with width of 5 mil. In fact, the more stringent criteria like 8 oz thick with 5 mil wide will probably OK. Since 8 oz copper is more than 11 mil thick, the trace aspect raio is bigger than 2!
So, how do I make it? We can start with 6 mil thick single side laminate with 1 oz copper clad. Cover the claded copper by photoresist or tape. Then, use laser to cut the circuits pattern from its no clading side with width of 5 mil (you can image that 4 mil or thinner is also possible). The laser cutting needs to cut into the copper foil on the opposite side so that the copper can be exposed. The claded copper is usually not damaged by laser if it is under control. The space between 2 traces can be 5 mil or higher, depend on how serious you have to concern on CAF issue. A desmear process is needed if you use CO2 laser. It can remove any resin residue on the bottom of the copper. Then, we can put it into the plating tank for copper plating. This is just like a pattern plating process used in PCB with very thick plating resisit. The plated copper will fill the laser cut groove, or circuit pattern, after enough plating time. In this case, the plated copper thickness is roughly 6 mil. We can use this plated laminate, after remove the photoresist, as an inner layer or outer layer core. After lamination with other circuits, the plated core can be etched from top side with copper foil clading. Together with the plated copper, the 1 oz copper foil plus 6 mil can have the total copper thickness over 5 oz. 
Like the previuos article, the etching can make the board having thinner copper when this etching process does not on the plating area. So, the thick and thin copper can be done on the same layer. Since most of the heavy copper is buried into laminate, the this and thick copper is on the same level without worry its height difference. And, since the heavy copper buried into core, we don't need to worry the peel strength of this thick trace even it has finer line.

PCB Assembly and PCB Fabrication

If you prototype printed circuit boards in the China., how can you ensure that laminates and prepregs you used will match those used in offshore volume production?

As an industry, those of us involved in designing and manufacturing electronic products can all agree that we now live and operate in a global supply chain environment. Since a lot of what is incorporated into current and next generation products is reflected in the software, this isn't much of a concern. Take your favorite products, download the latest software update and newly developed apps and you're ready to go.
When it comes to developing the pieces of hardware, the process is not so simple. And, when it comes to printed circuit board (PCB) development efforts, the process becomes even more challenging. That's because PCBs are the launching points for hardware product development and the laminate and prepreg materials used in designing and manufacturing PCBs are the nuclei for those boards. (Prepreg is fiberglass cloth that has been saturated with resin that is not fully cured. As a PCB is placed under the heat and pressure of lamination this resin melts and flows into the voids in the adjacent copper layers filling them.)
Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey to their OEM customers their highest confidences that their products are of the foremost quality and have been verified to operate according to their specifications.
An automatic test equipment printed circuit board, or ATE PCB -- serving as an interface to a large test system -- is at the heart of all major test activities to verify a specific chip's functionality.
This assures chipmakers their semiconductor products are good-to-go to an ever- burgeoning chip market led by newcomers, such as Internet of Things (IoT), wearables, handheld devices, and other similar products.
ATE PCBs are designed and assembled to test an array of different semiconductor chips, including microprocessors (µPs), memory, system-on-a-chip (SoC), field-programmable gate arrays (FPGAs), and others. However, an ATE PCB is designed and assembled specifically to test one particular kind of chip set. Some of today's highly advanced chips bring tens of millions of dollars into a chipmaker's coffers.
In order to achieve that highly-prized chip-testing quality for chipmakers, a group of experienced program and project managers and highly-trained and savvy engineering personnel in ATE PCB assembly are of paramount importance. The requirements for disciplined administration management and assembly line technical knowhow are above and beyond that required for conventional PCB assembly. Considerable monetary loss and lost time-to-market are incurred if there's a misstep along the way toward successful assembly completion of an ATE PCB.

Full Turn Key PCB Assembly

FULLTURN KEY PCB ASSEMBLY SERVICE TO SHORTEN THE CYCLE TIME OF NEW PRODUCT INTRODUCTION.

Hemeixin PCB offers Printed Circuit Board Fabrication and PCBA Assembly Turnkey Services including rigid PCB assembly, flexible circuit and rigid flex circuit boards Turn-key PCB Assembly.
Due to modernization, every aspect of life is now developing rapidly and latest technologies are also due to this modernization. Turn key PCB Assembly is also the part of this reform ion technology. The meanings of Turn key are to provide some documentation on your behalf to someone to build something. The other person on your behalf will get some additional parts for that product and will produce that required product. The simple meaning of Turn key is that if you wanted to make something this, you would send Gerber files, drill files, X-Y data and Bill of Materials (BOM) in Excel format (for both consigned and turnkey orders) of your desired products. On your marks, the other person will develop the product.

The whole process which I told in introductory paragraph is not necessary to be applied in PCB assembly.
Turn key PCB assembly is designed purely on the concept of a shift key. In PCB assembly we will not send PCB SMT assembly requirement and files to the developer instead of this we only will send the amount. Another person will buy the necessary material and then will complete the process of PCB assembly. This is a new type of services for PCB assembly which will ensure the service of PCB manufacturing for the production of boards free and fast for small businesses, entrepreneurs, and engineers.
If you wanted your PCB assembly, then you just have to put your desired board. We will notify you the best quote, and then our manufacturer will look after the whole of the process, and we will provide you with in your desired time-span. We assure you that we will never disappoint you and you can order us for turn-key PCB assembly at any time. There are many other service providers available in our region, but we assure you that we are the best and you will get the exact design which you will order us.
We specialize in quick-turn services for highly complexity and advanced PCB assembly and systems manufacturing in meeting your dynamic business needs.

Our competent engineering and manufacturing team help many customers resolve all kinds of PCB assembly problems which could not be fixed in other CM, thus we earned great reputation as the premier PCB assembly vendor. That is why many our customers refer many new customers to us. Our customers always find peace of mind when they send their PCB assembly jobs to us.
Quick Turn PCBA Prototype and NPI builds are mission-critical to the speed up "Time-to-Market" and the success of your company’s new product introduction, and it is crucial to have a competent and trustworthy EMS partner. Try us, and you will find that Hemeixinpcb can far exceed both other EMS vendors performance and your expectations.
Many of our customers have, with great satisfaction, transferred their PCB assembly operations to us from top tier electronic contract manufacturing providers, who frequently fail to provide priority attention, quality and responsiveness to any except their top-volume customers.
Through the entire PCBA prototype and NPI process, Hemeixinpcb has consistently provided on-time deliveries that exceed our customers' quality, speed, and service expectations. We frequently receive customer appreciations for our level of quality and service in helping then launching new products swiftly to market at lowest total cost.

Turn Key PCB Assembly Technology

Turn Key PCB Assembly is the now becoming advanced with the passage of time.
Due to modernization, every aspect of life is now developing rapidly and latest technologies are also due to this modernization. Turn key PCB Assembly is also the part of this reform ion technology. The meanings of Turn key are to provide some documentation on your behalf to someone to build something. The other person on your behalf will get some additional parts for that product and will produce that required product. The simple meaning of Turn key is that if you wanted to make something this, you would send money and specifications of your desired products. On your marks, the other person will develop the product.
The whole process which I told in introductory paragraph is not necessary to be applied in PCB assembly.
Turn key PCB assembly is designed purely on the concept of a shift key. In PCB assembly we will not send money and material to the developer instead of this we only will send the amount. Another person will buy the necessary material and then will complete the process of PCB assembly. This is a new type of services for PCB assembly which will ensure the service of PCB manufacturing for the production of boards free and fast for small businesses, entrepreneurs, and engineers.
If you wanted your PCB assembly, then you just have to put your desired board. We will notify you the best quote, and then our manufacturer will look after the whole of the process, and we will provide you with in your desired time-span. We assure you that we will never disappoint you and you can order us for turn key PCB assembly at any time. There are many other service providers available in our region, but we assure you that we are the best and you will get the exact design which you will order us.
There are many advantages if you will receive our services because many other people will not meet the deadlines which you assigned them. But we will fulfill every deadline and instructions ordered by you. You just have to put your design, and you will be notified on the spot about the quote of your design and the time duration of completion of turn key PCB assembly work. We developed a complete system by using which you can easily observe the current status of your project and how much time will require more you can quickly judge it.

The production of the prototype is usually a prolonged process, but we assure you that we will also do this work speedily. You will observe that the production of yours turn key PCB assembly is speedy and efficient. We are offering this service at very economical costs, and your product will assemble and ship to you instantly after the completion and tested by our quality control department. When your design is perfect, and you are happy with prototype, then we will produce a huge quantity in bulk. You can contact us at any time.

Complete Turnkey PCB Assembly

Complete Turnkey PCB Assembly to the speed up "Time-to-Market" and the success of your company’s new product introduction

Our quick turn custom prototyping services and inclination fetches quick turnarounds which puts our clients in command of their projects. Adapting a full fledge inspection system and pre- production check to authenticate the prototype quality to make prototypes ready to iterate has been our bonanza.

There are many demanding deliberations based on the plan for the level of production volumes and type of production in the PCB assembly project. To make sure that no criteria are overlooked and missed upon, we scrutinize and analyze all the aspects of your turn-key PCB assembly projects. Our flexibility to use human resource and machines with moderate technologies proves our reliability to load the project at the right time and economy.
The production of the prototype is usually a prolonged process, but we assure you that we will also do this work speedily. You will observe that the production of yours turn-key PCB assembly is speedy and efficient. We are offering this service at very economical costs, and your product will assemble and ship to you instantly after the completion and tested by our quality control department. When your design is perfect, and you are happy with prototype, then we will produce a huge quantity in bulk. You can contact us at any time.
We have adopted flexibility to provide prototyping services with full or partial turnkey pcb assembly wherein the components and all the inputs needed in the PCB assembly manufacturing as per the specifications in the BOM and Gerber File are being arranged by us fully or partially.
One of the in house PCB prototype marvels, Hemeixinpcb facilitates PCB assembly services with no fuss, simple and fast prototyping with a unique way of using advanced techniques like automated design analysis, algorithms and custom technical specimens depending on the Gerber file and BOM ( Bill of Materials ) required for a particular prototype.

There are many advantages if you will receive our services because many other people will not meet the deadlines which you assigned them. But we will fulfill every deadline and instructions ordered by you. You just have to put your design, and you will be notified on the spot about the quote of your design and the time duration of completion of turn-key PCB assembly work. We developed a complete system by using which you can easily observe the current status of your project and how much time will require more you can quickly judge it.
Our core focus is to give optimal cost effective inventory management services with a dynamic approach to utilization of manpower and machine as it is totally dependent on the low or high run production with accurate results. Our global outlay has made it possible to adopt an effective procurement process of the components used in the PCB assembly production to toss around the ease and difficulty in obtaining those components.
Our flexibility reaches to providing full or partial turnkey as well as consigned PCB assembly with custom prototyping services. To solve the problems pertaining to low volume and highly complex assemblies, we acute Flying Probe Testing. This helps us detect the missing components and validate the component placement. Securing prestige with our clients was possible by offering high tech PCB prototyping services like multi layered quick turn prototype, combined surface mount, chip-on-board (COB) and many other custom prototypes for aerospace, defense, telecommunication, medical and other varied industries.

We are today working successfully for our customers in varied industries like aerospace, telecommunication, defense, medical, automobile and robotics. We have developed a personalized approach at every stage of the PCB assembly process.

Heavy copper PCB fabrication and design increase reliability and durability

Power electronic products are making remarkable stand in PCB industry and Heavy Copper PCB is one among them. The design has lots of benefits and is widely used for lasting results. Heavy copper PCB features a thickness of more than 4oz which is much higher as compared to the standard PCBS which has 1oz or 2oz of thickness.
There are various utilization of these PCBs and are mechanically assembled with layers of fiberglass sheets. These sheets are laminated with copper patterns. These circuit boards are produced with specialized plating and etching technique. A traditional circuit board trace is not necessarily rectangular in shape, but depends on size and manufacturing process. Heavy copper PCB conductors are responsible for adding significant thickness to the overall board.
The reason that Heavy Copper PCB supports large electric currents and is reliable, it is used in heavy electric works including solar batteries, electronic control of motors for eco cars etc. There are various other usages as well which make Heavy Copper PCB a reliable option.
Benefits of Heavy copper PCB that makes it a great option for power supply.
These circuit boards increase endurance to thermal strain. With great mechanical strength, they show at connector sites, they are highly desirable. The design is compact and the multiple copper weight is incorporated on the same layer, making it fit for most of the electrical tasks. Heavy Copper PCB has a capacity to carry high current. The amount of current a circuit can carry depends on the heat rise it can withstand. You can determine the minimum width and thickness of these heavy copper PCB through the current carrying capacity required with the maximum allowable temperature rise.
Heavy Copper PCB are a great option to fulfil the need of high current. As a single layer can accommodate two different circuit types, high density wiring is a piece of cake for these designs.
There is no doubt that designers are always striving for best results and performance. This has given room for more improvement and complex of circuit designs.
Application of Heavy Copper PCB in Military operation.
Almost every power electronic products, especially Heavy Copper PCB have been a major requirement for military as well as aerospace centers for many years. It is continuously gaining momentum and is supposed to grow in term of design and application as the industry's demand grow.
The various technologies that use Heavy Copper PCB for successful operation includes Weapons Control Systems, Primary and Secondary Windings of High Power Planar Transformers, Power Supplies for Radar Systems, Power Distribution Panels and Battery Charger and Monitoring Systems.

The more the industry is growing, the huge momentum it is gaining for making it better. Heavy Copper PCB is capable of making a lot of things possible through its current carrying capabilities.