Rigid-flex Circuits Stackup

Rigid-flex circuits is a complicated product that demands a lot of interaction between the PCB provider and the customers. Like other complex products, early discussions between Hemeixinpcb and the designer is necessary to optimize the design for manufacturability and to optimize costs. Hemeixinpcb supports rigid-flex circuits boards for higher volume requirements.
Please send email to sales@hemeixinpcb if you need further information or assistance, we are happy to help you.

Rigid-flex circuits technology using ELIC is receiving increased emphasis in new product designs to achieve:

Higher volumetric interconnection of components and structural featuring within the PCB.

Elimination of traditional connectors and ACF bonding FPCs to rigid PCBs within herent cost and reliability issues.

Laminate, Materials, Chemistry, and Equipment suppliers roadmaps are on track to provide compatible LF/HF materials and µvia process systems for Rigid-flex to move to mainstream.

Global market demand for Smartphones and Tablets have accelerated (and funded) the technology development of stacked µvias and associated mass production infrastructure.

Filled via rigid-flex circuits technologies are now essential rigid-flex circuits PCB fabrication processes to achieve high SMT yield and reliability for Area Array IC package and fine pitch passive components assembly.

Filled and stacked µvia sequential processing is maturing to very high yields.

Conventional PTH Rigid-flex circuits Product Examples



ELIC HDI Rigid-flex circuits Technologies



Filled µvia HDI
Technical Advantages of solid via
Improved solder join reliability
Elimination of air bubble
Reduce solder short in BGA (0.5mm pitch or less )
Improved PCB design
Enhance circuit routing flexibility
Size reduction of PCB

Improve thermal performance
Enhance signal quality (shorter path)
Plated stacked uVia Process overview