What are the forms of PCB assembly for electronic product assembly?

Electronic products assembly PCB assembly form:

I. single-sided assembly:

Incoming inspection of solder paste (adhesive point = > screen) = > > = > (curing) dry patch reflow soldering repair two = > = > = > cleaning detection, two-sided assembly;
A: A = > PCB incoming inspection screen printing solder paste (point adhesive patch) = > = > = > A (dry curing) surface cleaning reflow soldering turning plate PCB = > = > = > B (solder paste adhesive printing point) = > = > = > dry patch reflow soldering

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(best only for B = > = > > detection surface cleaning repair)
This process is applicable to the larger SMD, such as PLCC, on both sides of the PCB.
B: A = > PCB incoming inspection screen printing solder paste (point adhesive patch) = > = > = > A (dry curing) backstreaming repair B adhesive patch point = > = > = > B > wavesoldering curing surface cleaning detection of welding cleaning = > = > = > = > = > PCB) flap              electronic assembly services
This process is suitable for reflow soldering on the A surface of PCB, B wave soldering. In the B assembled on the PCB surface of the SMD, this process should be adopted only when the SOT or SOIC (28) pin is below.
Three, single mixing process:
Incoming inspection PCB A = > screen printing paste (point adhesive patch) = > = > drying (curing) = reflow soldering plug-in = > = > > cleaning = > = > = > repair cleaning detection

Four, double mixed process: A: B = > PCB incoming inspection points of adhesive curing flap patch = > = > > >
Repair A plug-in soldering cleaning = > = > = > = > PCB detection after stick plug, suitable for SMD more than the element separating element

B: A = > PCB plug-in incoming inspection (pin bending) = > flap = > PCB B = > > point of adhesive patch curing turning plate soldering = > = > > > = > repair cleaning detection
First insert and post, suitable for separating components more than SMD components

C: incoming inspection A = > PCB = > = > > drying screen printing paste patch reflow soldering > plug-in, pin bending turning plate =>PCB B = > = > = > point of adhesive patch curing turning plate soldering = > = > > > = > A detection repair surface cleaning mixed, B surface mount.